Semiconductor Processing Applications
GENTIGER provides the machines with high-precision linear motors and ball-screw, which are used in the processing of probe card modules and micro-holes in advanced semiconductor manufacturing equipment. The processing accuracy can reach ±0.002mm.
Wafer manufacturing equipment, ion implanter consumables (processing of pure tungsten, molybdenum, palladium, etc.), low brittleness of products, low tool wear, and other advantages, combined with high rigidity of the machine, create a perfect solution for the semiconductor industry.
- Material：WU MO
- Accuracy：0.02mm
- Recommend：GT-66V
The use of gate type high-rigidity high-speed machining center for semiconductor parts processing can reduce tool wear, improve surface quality, and have good precision.
- Material：6061-T6
- Spindle speed：250 rpm
- Recommend：GT-ML800
The diameter is 350mm and the thickness is 200mm. Thin-wall cutting on the side, excellent rigidity of the machine, reducing thin-wall chattering, smooth turning surface, and accuracy within 0.03mm.
- Material：SUS316
- Spindle speed：2500 rpm
- Recommend：GT-ML800
3600 hole drilling for thin parts, five-axis work-piece, using GT-ML800 with a 45-degree head for multi-angle swing axis processing, with good precision, quality and drilling stability.
